July 2026 by Éva Trungel (CDTV)
As computing platforms continue to increase in performance, mechanical design plays a critical role in ensuring structural integrity, serviceability, and effective thermal management. In this project, CAD-Terv developed the mechanical concept of a modular liquid-cooled computing platform, building upon experience gained during the development of a previous prototype.
Modular Architecture
The enclosure is based on a sheet metal structure that provides rigidity while supporting the electronic assemblies and cooling infrastructure. Internal modules were arranged to simplify assembly and maintenance activities while maximizing available installation space.
Serviceability
A key design objective was easy assembly and servicing. Compute and storage modules are mounted as removable subassemblies, allowing straightforward installation and replacement when required. Proven solutions from the previous prototype were reused and adapted to support larger modules and integrated liquid cooling.
Cooling Integration
The most significant mechanical challenge was the integration of the liquid-cooling system. Dedicated cooling loops and cold plates were incorporated directly into the enclosure architecture to ensure efficient heat removal while maintaining accessibility and manufacturability.
Multiple Installation Options
The platform was developed in both rack-mounted and wall-mounted configurations, providing flexibility for different deployment environments. Additional handling features support transportation, installation, and maintenance operations.
Next Steps
The concept phase established the overall mechanical architecture, cooling integration approach, and serviceability strategy. The next stage will focus on detailed design, prototype manufacturing, assembly validation, and thermal testing.
