eHPS - embedded High Performance Server

Partners

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Addressed Markets

  • High performance Edge Computing applications with a power budget of 500 W (single server) – 5 kW (small cluster)
  • Heterogeneous computing leveraging hardware accelerators like GPUs and FPGAs
  • Applications with high-bandwidth and low-latency requirements demanding PCIe Gen6
  • Widely available air-cooled 19” rack server housings (E-ATX form factor)

Main Features

  • Support for three modular compute modules
    • 1x COM-HPC Server Type D+E
    • 1x COM-HPC Client Type A+B+C
    • 1x COM-HPC Client Type A+B
  • Support for heterogeneous computing and hardware acceleration (GPU, FPGA)
  • Flexible PCIe Gen6 -based Communication Infrastructure
    • Switched PCIe for high-speed interconnection between nodes, enabling host-to-host communication
    • Direct coupling of other eHPS in the same rack/data center using 4x PCIe Gen 6 via MCIO
    • 3 PCIe Expansion slots for additional accelerators or Network Interface Cards (NIC)
    • 10 GbE per compute module (direct connect)
  • Board management via BMC
    • One centralized BMC to control and monitor all compute nodes
    • Web-based UI or Redfish interface for remote control
    • 1GbE Out-of-Band (OoB) interconnect per compute module